We are excited that our new Reactive Ion Etcher (RIE) has been fully set up and is ready for sample test after two weeks’ installation.
Reactive Ion Etching transfers a pattern into a material using reactive plasma. With avalialbe process gases including SF6, CF4, CHF3, C4F8, Ar, O2, and toxic Cl2, and BCl3, our RIE can etch a wide variety of materials such as two-dimensional thin film, silicon, and GaN semiconductors with desired features sizes, aspect ratios, and depths.
Combined with existing Electron Beam Evaporator and Mask Aligner, users from materials, energy, electrical engineering, physics, and biology can now complete device manufacturing at West Campus, further supporting collaborations and the rapid development of nanoscale science, engineering and technology at Yale.
This picture shows Oxford engineer, with powered air-purifying respirator (PAPR), is testing the gas lines after Cl2 cylinder was connected to gas cabinet,
Please contact us if you are interested in using RIE.